José María López Villegas, University of Barcelona, Spain
Traditional electronic circuit design and manufacturing follows an orthogonal pattern. Everything is either horizontal or vertical. The different layers a circuit consist of are designed and manufactured using 2D tools and then are stacked and vertically interconnected.
The aim of this special session is to explore the advantages and new opportunities that escaping from planarity can offer in the context of electronic circuit design and manufacturing.
Prospective authors are invited to submit technical papers concerning the design of full 3D devices and circuits as well as the use of non-planar manufacturing processes, including 3D printing, shaped substrates or flexible substrates, applied to the fabrication of electronic devices and circuits